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Molex Announces New MicroTPA 2.00mm Wire-to-Board and Wire-to-Wire Connector System

2019-09-12 | Return

Molex has released the MicroTPA 2.00 mm wire-to-board and wire-to-wire connector system to provide electrical and mechanical reliability in high temperature designs to meet the requirements of many industries. These connectors are ideal for use in the consumer and automotive markets requiring compact wire-to-board and wire-to-wire connector systems with current ratings up to 2.5 amps for use in confined spaces.

The MicroTPA 2.00 mm wire-to-board and wire-to-wire connector system offers many advantages. Two to fifteen circuits are available in the in-line connector system, accepting a wide range of wire sizes and using crimp terminals on the market. The popular product, equipped with TPA bearing ring, locking structure, RoHS compliant, can withstand high temperatures, and is designed with a vertical through hole joint with a pitch of 2.00 mm.

Mariko Okamoto, global product manager at Molex, said: "The new MicroTPA connector system is designed to withstand harsh environmental conditions. For example, the bottom of the connector and the ledge are lifted so that the potting material covers the entire printed circuit board. Thereby preventing moisture from entering the connector and avoiding some common problems in conductivity."

The MicroTPA 2.00 mm wire-to-board and wire-to-wire connector system delivers 2.5 amps of current compared to similar connector systems on the market, with temperatures ranging from -40 to +105 ̊C and cable ranges from 0.85 mm to 1.50 mm.

Source：http://www.molex.com