Samsung Electro-Mechanics

Samsung Electro Mechanics (SEMCO) was established in 1973 as a subsidiary of Samsung Corporation. SEMCO is a global leader supplying passive components in multiple industry sectors. SEMCO consists of four divisions: optical & mechatronics, circuit drive, advanced circuit interconnect, and LCR. SEMCO has manufacturing presence in five countries and direct sales presence in over fifteen countries.

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Product Categories                                                                                                                                         

Passive Component --------------------------------------------------------------------------------------------------

MLCC
Multilayer ceramic capacitors (MLCC) are general-type capacitors that store electric charge temporarily and remove noise. They have a structure in which dielectric layers and internal nickel electrode layers are interlaminated. More...

Inductor

Inductors are surface-mounting–type parts made through a multilayer process, a winding process, and a thin film process. They are passive components that display inductance. They are mainly used for the smoothing of power circuits, the impedance matching of RF circuits, the L-C filters, and the LC resonant circuits. More...

Chip Resistor
Chip resistors have the characteristics of limiting DC or AC. Such characteristics are used to drop the voltage or maintain the current at a certain level inside an electronic circuit. Resistance basically follows the Ohm’s law. Materials of high and low electrical conductivities are used together to realize the required resistance value. The main resistance element materials of chip-type resistors are SiO2, RuO2, and CuNi, making it possible to make products that have high resistance, low resistance, ultralow resistance, antisulfur, and array resistance properties. More...

Tantalum
Tantalum capacitors are divided into manganese dioxide type and conductive polymer type, depending on the type of cathode electrolyte. Manganese dioxide–type products range from small to large in size and low to high in capacitance. Polymer type products have low ESR. Tantalum capacitors are designed as chip-type products to ensure that they can be surface-mounted. They are eco-friendly products.  More...


Filter
There are signal beads that remove noise of general signal lines, power beads that remove noise of power lines, GHz beads that remove noise in the GHz band, and CMF (Common Mode Filter) that removes common mode noise at the differential mode communication side (USB, HDMI, and CAN communication).  More...

Module ------------------------------------------------------------------------------------------------------------------------

Camera Module
High-level technologies are required for mobile devices as they become small and slim and customers demand high resolution and multiple functions. We own advanced technologies based on optical, electronic, and electric mechanism design know-how that are necessary for camera modules. More...



Wireless LAN
Wireless LAN is a wireless transmission and reception system for short-distance data in compliance with IEEE 802.11–based communication standards. It is also called “Wi-Fi.” As there is an increasing number of applications that require wireless LAN, such as smartphones, tablet PCs, and home appliances, there is a trend of shifting from a mono wireless LAN module to a combo module that can realize various communicaiton methods, such as Bluetooth, FM, and GPS, in a single package. More... 

Substrate ------------------------------------------------------------------------------------------------------------------------

Package Substrate
The product is a package substrate that is used for the core semiconductors of mobile devices and PCs. It transmits electric signals between semiconductors and the main board. Compared with general substrates, as this substrate is a high-density circuit substrate containing more microcircuits, the assembly defects and incurred costs in directly bonding expensive semiconductors to the substrate can be reduced. More...


HDI
High-density interconnection (HDI) substrates have high-density circuits that make it possible for electronic parts mounted on a PCB to send and recieve electrical signals between themselves. More...




RF PCB

As there is no need to use connectors between modules, this substrate is advantageous in terms of miniaturization. It is also possible to increase the degree of freedom in design by maximizing the set space utilization.  More...

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