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News
pSemi Announces World’s First Monolithic, SOI Wi-Fi Front-end Module
2018-08-14 | ReturnThe PE561221 combines the intelligent integration capabilities of pSemi’s SOI technology and Murata’s expertise in Wi-Fi connectivity solutions and advanced packaging. This 2.4 GHz Wi-Fi FEM integrates a low-noise amplifier (LNA), a power amplifier (PA) and two RF switches (SP4T, SP3T). The monolithic die uses a compact 16-pin, 2 x 2 mm LGA package ideal for either stand-alone use or in 4 x 4 MIMO and 8 x 8 MIMO modules.
“The new IEEE 802.11ax standard is utilizing high-order modulation schemes (1024 QAM) with demanding EVM requirements,” says Colin Hunt, vice president of worldwide sales at pSemi. “Traditional process technologies struggle to keep up with both performance and integration requirements, and only SOI can offer the ideal combination of integration and high performance. This new monolithic Wi-Fi module is a great example of the types of technology and product advancements pSemi and Murata can accomplish together.”
The 2.4 GHz Wi-Fi FEM is based on pSemi’s UltraCMOS® technology platform—a patented, advanced form of SOI. With its outstanding RF and microwave properties, SOI is an ideal substrate for integration. When paired with high-volume CMOS manufacturing—the most widely used semiconductor technology—the result is a reliable, repeatable technology platform that offers superior performance compared to other mixed-signal processes. UltraCMOS technology also enables intelligent integration—the unique design ability to integrate RF, digital and analog components on a single die.
source:http://www.psemi.com