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Murata collaborates with Silicon Labs on IoT matching device

2015-09-03 | Return

Murata Manufacturing Co., Ltd.
President/Statutory Representative Director: Tsuneo Murata

Murata today announced the LFD21891MMF3D931 high frequency matching device for use in sub-GHz 802.15.4 wireless Internet of Things (IoT) applications. Designed in collaboration with Silicon Labs*1 and optimized for use with their Si4461 868 MHz*2 wireless transceiver IC, the matching device incorporates all the necessary components in an ultra compact package. Integrated in a low profile device measuring just 2.0 x 1.25 x 0.7 mm, the footprint is approximately 75 percent smaller than using traditional discrete components.

As the demand for IoT applications grows so does the need for engineers to quickly integrate wireless connectivity into their application. Typically requiring specialist knowledge in designing wireless circuitry, the availability of a transceiver together with an optimized matching device helps speed product design and engineering resources required.

Mass production of the LFD21891MMF3D931 will commence in October 2015.

*1…Silicon Labs is a leading provider of microcontroller, wireless connectivity, analog and sensor solutions for the Internet of Things.
*2…The transceiver IC supports the sub-1 GHz band (IEEE802.15.4). More information can be found here.

Source：http://www.murata.com/