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SO6L package IC coupler for IPM drive: TLP2704

2015-08-21 | Return
The package photograph of SO6L package IC coupler for IPM drive: TLP2704.Toshiba has launched a photocoupler “TLP2704” for driving IPMs (Intelligent Power Modules).

TLP2704 uses the 2.3 mm thick SO6L thin package, contributing to slimmer sets. As this product features creepage distance of 8 mm and isolation voltage of 5 kVrms despite its thin package, it is also suitable for applications requiring high insulation performance.

TLP2704 is an inverter logic type with open collector output. With a data transmission rate of 1 Mbps and wide power supply voltage range from 4.5 to 30 V, this product is suitable for IPM drive.

Applications/ Outline Drawing

Applications
  • FA equipment (for IPM drive)
  • AC drives
  • Programmable controllers

Outline Drawing
The illustration of outline drawing of SO6L package IC coupler for IPM drive: TLP2704.

Features

  • 2.3 mm thin SO6L package
  • A clearance and creepage distance of 8 mm (min)
  • Wide operating temperature range: Topr= -40 to 125 °C
  • Data transmission: 1 Mbps (typ.) (NRZ)
  • LED adoption excellent in the lifetime characteristic
  • Threshold input current: IFHL=5 mA (max)
  • Common-mode transient: CMH/CML= ±20 kV/μs (min)

Main Specifications

Part
number
Package Absolute
maximum
ratings
(@Ta=25 °C)
Operating
range
IFHL
max
(mA)
ICC
max
(mA)
tpLH
max
(ns)
|tpHL-tpLH|
max
(ns)
tpsk
max
(ns)
CMH/CML
min
(kV/μs)
BVS
(Vrms)
VCC
(V)
TLP754
DIP8
5000 4.5 to 30 5 1.3 550 400 450 ±20
TLP714
SDIP6
5000 ±20
TLP2404
SO8
3750 ±15
TLP104
SO6
3750 ±15
TLP2704*1
SO6L
5000 ±20
*1: New product

Circuit Example

IPM drive



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Source: http://www.semicon.toshiba.co.jp/eng/