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News
Cypress Expands HyperFlash Line of the Industry’s Fastest NOR Flash Memories
2015-08-10 | ReturnSAN JOSE, Calif., August 10, 2015 – Cypress Semiconductor Corp. (Nasdaq: CY), a global leader in embedded systems solutions, today expanded its NOR HyperFlash™ product line with the qualification of a new 256Mb memory. The 3.0V S26KL256S HyperFlash device is the latest addition to the industry’s first flash memory family that supports the high-bandwidth, low-pin-count HyperBus™ interface. The device is ideal for high-performance applications, such as automotive instrument clusters, industrial automation, communication systems, and medical equipment, which need the highest read bandwidth to enable the fastest boot time for instant-on requirements, along with a low-pin-count interface to reduce package size and PCB cost.
Running at frequencies up to 166MHz, HyperFlash products can achieve Double-Data-Rate (DDR) read bandwidths as high as 333 MBps for 1.8V products and 200 MBps for 3.0V products. The 256Mb HyperFlash device is offered in a space-saving 48-mm2 24-ball package, and it delivers high reliability and extended temperature range of -40ºC to +125ºC. Cypress’s HyperFlash memory family offers 3.0V and 1.8V versions and includes three densities: 128Mb, 256Mb and 512Mb. Cypress HyperFlash devices provide a seamless migration path from Quad SPI to dual Quad SPI to HyperFlash memory, allowing system applications to be scaled to different levels of flash performance when paired with compatible controllers. This provides OEMs the ability to offer different product models with a single design.
“With the trend toward instant-on systems for automotive, industrial and communication applications, we are seeing more and more interest from chipset manufacturers for the high-bandwidth, low-pin-count HyperBus interface, and increased demand from our customers in these segments for our HyperFlash and HyperRAM™ memories,” said Hiro Ino, Senior Director of the NOR Flash Product Family at Cypress. “Our new 3.0V, 256Mb HyperFlash device is part of our plan to provide a range of voltage and density options to help meet this demand.”
Originally announced in 2014, the HyperBus interface is supported by an increasing number of chipset suppliers adopting the HyperBus high-performance solution for their next-generation products. Processors that have been publically announced to support the HyperBus interface include the Freescale MAC57D5xx Automotive DIS MCU, the Cypress FM4 S6E2DH general purpose MCU and the Cypress Traveo™ S6J324C and S6J326C automotive MCUs. Cypress is working closely with many processor companies and dozens of platforms are currently in development to support the HyperBus interface.
About Cypress HyperBus Interface
The efficient 12-pin Cypress HyperBus interface consists of an 8-pin address/data bus, a differential clock (2 signals), a chip select and a read data strobe for the controller—all of which help reduce the overall cost of the system through reduced pin count. Memories based on the interface enable systems with faster response times and rich user experiences. The Cypress HyperBus interface enables a wide range of high-performance applications, such as automotive instrument clusters, infotainment / navigation systems, handheld displays, digital cameras, projectors, industrial automation, communication systems, medical equipment, and home appliances.
Availability and Photo
Cypress’s 3.0V, 256Mb S26KL256S HyperFlash is sampling now with production expected in the third quarter of 2015. It will be available in both 3.0V and 1.8V versions packaged in a market-compatible 6 mm x 8 mm ball grid array (BGA). It currently supports the Industrial-plus temperature range of -40ºC to +105ºC. Cypress will offer support for the extended temperature range of -40ºC to +125ºC at a later date. Both the 3.0V and 1.8V versions of the 512Mb HyperFlash are sampling now, and the 128Mb will begin sampling in the third quarter of 2015. A photo of the device is available below.
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Source：http://www.cypress.com/