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A high-speed (20 Mbps) IC photocoupler featuring a creepage distance of 8 mm: TLP2768A

2015-07-24 | Return

Toshiba has launched a photocoupler for communication applications: “TLP2768A” that features high speed and high temperature operation.By adopting the SO6L package that has just 2.3 mm thick while guaranteeing a creepage distance of 8 mm and isolation voltage of 5 kVrms, this product offers a thickness reduction of approximately 45 % compared with the existing SDIP6 package. This allows the sets to be slimmed down while maintaining high insulation performance. This product has a high-reliability infrared LED in its input side, and it has an open-collector output type high-speed photo IC in its output side which is capable of high-speed data transmission at 20 Mbps and supporting both 3.3 V and 5 V power supplies.

Demand for high-temperature operation of functional elements has increased in the industrial equipment field as systems are further downsized and packaged at higher densities. With its operating temperature range of -40 to 125 °C, this product is suitable for use in high-speed communication interfaces for factory automation (FA) devices, as well as various digital home appliances such as IH devices.

Applications

FA network
High-speed digital interface for measurement or control devices
I/O interface board

Features/ Outline Drawing

Outline Drawing

Features
2.3 mm thin SO6L package
Guaranteeing a clearance and creepage distance of 8 mm
High-speed data transmission: 20 Mbps (typ.) (NRZ)
Supporting 3.3 V/5 V system power supply voltage: Guaranteed operation with power supply voltage between 2.7 V and 5.5 V
LED adoption excellent in the lifetime characteristic
High operating temperature: Topr (max)=125 °C

Main Specifications

*1: New product
TLP2768/TLP2768A

Circuit Example

Source：http://www.semicon.toshiba.co.jp/eng/