Manufacturers
- Abracon
- Adam Tech
- Aerospace, Defense & Marine
- Agastat
- AIC
- AKM Semiconductor
- Alcoswitch
- Allegro
- Alps Electric
- Altera
- AMI Semiconductor
- AMP
- ams
- Analog Devices (ADI)
- Aptina Imaging
- Atmel
- Avago / Broadcom
- AVX
- Axicom
- Bccomponents
- Beyschlag
- BI Technologies
- Bourns Inc.
- Bowei Integrated Circuits
- Bridgelux
- Buchanan
- California Micro Devices
- Catalyst Semiconductor
- CGS
- Cirrus Logic
- Citizen Electronics
- CML Microcircuits
- Coiltronics
- Cooper Bussmann
- Corcom
- Core Logic
- Cree
- CSR PLC
- CTS
- Cypress Semiconductor
- Dale
- Data Image
- Deutsch
- Diodes Incorporated
- DOMINANT Opto Technologies
- E-T-A
- Eaton
- ECS
- Edison Opto
- Elcon
- EPCOS
- Epistar
- Epson
- Everlight Electronics
- Exar
- Fairchild Semiconductor
- FCI
- Freescale Semiconductor
- Fremont Micro Devices (FMD)
- Fujitsu Semiconductor
- Fulltech Electric
- General Semiconductor
- Harvatek
- Holsworthy
- Hsuan Mao Technology
- IDT
- Infineon Technologies
- Innolux
- International Rectifier (IR)
- Intersil
- IRC
- ISSI
- IXYS-IC
- Jing Cheng Electronical
- JL World
- Johanson Dielectrics
- Johanson Technology
- JRC / NJR
- JST
- KEC
- Kilovac
- Kingbright
- Kyocera Industrial Ceramics
- LEDiL
- Linear Technology / ADI
- Lite-On Technology
- Littelfuse
- Lumex
- Lumileds
- Luminary Micro
- Luminus Devices
- Macronix
- Maojwei / ZJPT
- Maxim Integrated
- MCC
- Mean Well Enterprises
- Microchip Technology
- Micron
- Microsemi
- Mini-Circuits
- Molex
- Murata Manufacturing
- Murata Power Solutions
- MWT
- National Semiconductor
- Nichicon
- Nippon Chemi-Con
- NJR / JRC
- NVE
- NXP Semiconductors
- OEG
- Omnivision
- ON Semiconductor
- Optek Technology
- Optrex
- OSRAM Opto Semiconductors
- OTAX
- Panasonic
- Peregrine(pSemi)
- Potter & Brumfield
- Power Integrations
- PowerStor
- Preci-Dip
- Prewell
- Products Unlimited
- Pulse Electronics
- PulseCore Semiconductor
- Qorvo
- Raychem
- Renesas Electronics
- RFMD
- Richtek Technology
- ROHM Semiconductor
- Rubycon
- Samsung Electro-Mechanics
- Samsung Semiconductor
- Schaffner
- Schrack
- Seiko Instruments, Inc. (SII)
- Semtech
- Sensata
- Seoul Semiconductor
- Sfernice
- Sharp Display
- Sharp Microelectronics
- Silicon Labs
- Siliconix
- Skyworks Solutions
- SoniCrest / JL World
- Spansion
- Sprague
- Stanley Electric
- STMicroelectronics
- Sunny Electronics
- Susumu (SSM)
- Taimag
- Taiyo Yuden
- TDK
- TDK-Lambda
- TE Connectivity
- Teccor
- Texas Instruments (TI)
- Thin Film
- Tianma Micro-electronics
- TOCOS
- TOKO
- Toshiba Electronic Components
- TT Electronics
- Tusonix
- TXC
- Tyntek
- Vishay
- Vishay Precision Group
- Vitramon
- Walsin Technology
- Weidmuller
- Welwyn
- Wickmann
- Winbond
- Xilinx
- Yageo
- Zetex Semiconductors
- ZJPT / Maojwei
News
Industry-first embedded SIM from STMicroelectronics supports new standard expected to revolutionize bulk IoT device management
2024-06-19 | ReturnSTMicroelectronics has introduced the ST4SIM-300, the first embedded SIM in the industry to meet the incoming GSMA standard for eSIM IoT deployment. Also known as SGP.32, the new standard introduces special features to facilitate managing IoT devices connected to cellular networks.
“Leveraging the incoming GSMA specification, our embedded SIM for IoT solution, ST4SIM-300, enhances flexibility, eases network provider switching, and simplifies managing large numbers of connected devices,” said Agostino Vanore, Edge Authentication and M2M Cellular Marketing Manager at STMicroelectronics. “In a more connected and secured world, it will enable seamlessly track assets across the globe, connect smart devices to the cloud, and securely handle data from billions of devices, supporting our healthcare and smart infrastructures, cities, factories, and homes.”
Unlike existing eSIM machine-to-machine (M2M) and eSIM Consumer specifications, eSIM for IoT (SGP.32) is created for the needs of today’s IoT deployments. ST’s ST4SIM-300 supports features including greater automation of remote SIM provisioning (RSP), easily managing SIM profiles for large fleets of devices, and remote switching between network providers that eliminates physical SIM card swaps. The new eSIM conforms to the latest 5G standard and facilitates deploying devices that have a limited user interface and deploying low-power wide-area network (LPWAN) devices.
ST is sampling ST4SIM-300 eSIMs in various form factors, including wafer-level chip-scale packages (WLCSP) suitable for smart meters, GPS trackers, asset monitors, remote sensors, medical wearables, and similar devices.
Built with an EAL6+ certified ST secure microcontroller, the ST4SIM-300 is architected for security from the ground up. Compatible with GSMA IoT SAFE applet the eSIM facilitates adding secure element features for end-to-end communication and supports scalable security by design for creators of IoT devices.
Pricing information and sample requests are available at local ST sales offices.
Please visit https://www.st.com/st4sim-300 for more information.
Source: http://www.st.com