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News
i-ToF imager based on Infineon’s novel pixel technology boosts 3D camera system performance at optimized cost
2022-12-01 | ReturnInfineon's latest pixel technology includes advanced 3D field engineering enabling best demodulation efficiency. Additionally, a buried optical reflector elevates quantum efficiency (QE) to a level so far only reached by back-side illumination (BSI) sensors, while maintaining the cost advantage of front-side illumination (FSI) sensors. Combined with the IRS9102C VCSEL driver, the IRS2975C reduces the bill of materials for camera modules and provides differentiating features for the high-volume smartphone segment.
The IRS2975C features a half-quarter video graphics array (HQVGA) resolution of 240 x 180 pixels with a market-defining chip size of 18 mm 2 for a 1/6" image circle. It offers high-sensitivity 10 µm pixels with SBI and enables highly integrated systems with low-power operation. The imager is designed to support 2.8 volt supply rails. Furthermore, the device provides full laser safety functionality such as a unique eye protection mechanisms and offers high flexibility in customizing use cases and output power.
Availability
The IRS2975C imager will enter mass production in early 2023. Additional information is available at www.infineon.com/tof-3d-image-sensors-for-consumer.
Press Photos
Form factor and performance of the IRS2975C are tailored to the growing spot iToF applications, delivering highest possible operating range at optimal power budget.
▶ IRS2975C_application
▶ IRS2975C_product
Source: https://www.infineon.com