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뉴스
Lineup Expansion of -60 V P-Channel Power MOSFETs that Contribute to Lower Power Consumption for Automotive Equipment
2023-06-14 | 반환The new products XPH8R316MC and XPH13016MC are qualified with the automotive reliability standard AEC-Q101.The SOP Advance(WF) package is a surface mount type that uses a wettable flank terminal structure, which facilitates automated visual inspection of the board mounting state. In addition, it has reduced package resistance by adopting the Cu connector structure.
The maximum drain-source On-resistance of XPH8R316MC is 8.3 mΩ, which is approximately 25 % lower than that of Toshiba’s existing product TPCA8123[1], and XPH13016MC is 12.9 mΩ, which is approximately 49 % lower than that of Toshiba’s existing product TPCA8125[1]. This contributes to low power consumption of automotive equipment.
Note:
[1] SOP Advance package
Applications
>Automotive equipment: load switches, semiconductor relays, motor drives, etc.
Features
>AEC-Q101 qualified
>Low On-resistance
XPH8R316MC: RDS(ON)=8.3 mΩ (max) (VGS=-10 V)
XPH13016MC: RDS(ON)=12.9 mΩ (max) (VGS=-10 V)
>SOP Advance(WF) package with wettable flank terminal structure and Cu connector structure
Main Specifications
(Ta=25 °C unless otherwise specified)
Internal Circuit
Application Circuit Example
Note:
The application circuits shown in this document are provided for reference purposes only.
Thorough evaluation is required, especially at the mass-production design stage.
Providing these application circuit examples does not grant any license for industrial property rights.
* Company names, product names, and service names may be trademarks of their respective companies.
* Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.
Source: https://www.global.toshiba