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Commercialized Compact Wireless Modules Support Wi-Fi™ 4/5 and Bluetooth® 5.2 - Contributing to Early Market Release and Miniaturization of IoT and Industrial Equipment -

2022-08-25 | 返回

Murata Manufacturing Co., Ltd. (“Murata” below) has developed and mass-produced the compact wireless module LBEE5KL1YN (“Type 1YN” below) with a built-in Wi-Fi™/Bluetooth®/Bluetooth Low Energy combo chip CYW43439 of Infineon Technologies AG (“Infineon” below). Murata has also released the compact wireless module LBEE5PK2AE (“Type 2AE” below) with a built-in Wi-Fi/Bluetooth/Bluetooth Low Energy combo chip CYW4373E of Infineon.

Following the recent years of rapid growth in the IoT market, installation of wireless communication functions on IoT devices and industrial equipment has become necessary.　Compact and high-performance communication modules are required for IoT devices and compact, high-performance, and wide temperature range communication modules are required for industrial equipment.

This product achieves a compact, high-performance, and shielded structure through Murata’s unique wireless design technologies, space saving implementation technologies, and product processing technologies. While being compact, the Type 1YN achieves high speed communications while supporting Wi-Fi 4*1 and Bluetooth 5.2. The Type 2AE has high temperature capabilities while supporting Wi-Fi 5*2 and Bluetooth 5.2. With the hardware mechanism and algorithm, simultaneous use of both Wi-Fi and Bluetooth is available, optimizing both their performances. Furthermore, as control interfaces, they support PCM for audio data communications. Both are optimal for the IoT market, which requires compact, high-performance, and low noise products, as well as for applications in handheld wireless systems, gateways, and industrial equipment.
Furthermore, the modules comply to the Japanese and U.S. Radio Laws, contributing to the early stages of our customers’ product development.

*1 Wi-Fi 4: Wireless LAN standard name, IEEE802.11b/g/n
*2 Wi-Fi 5: Wireless LAN standard name, IEEE802.11a/b/g/n/ac

Key features

● Compact and high-performance SMD type
○ Type 1YN: Compact at a measurement of 6.95 × 5.15 mm, supports Bluetooth 5.2, Wi-Fi 4 and SoftAP
○ Type 2AE: Compact at a measurement of 8.0 × 7.8 mm, supports Bluetooth 5.2, Wi-Fi 5, USB2.0 and available for use in a wide temperature range of −40°C to 85°C

● Radio Regulatory certified
○ Individual acquisition of Radio Regulatory certifications unnecessary since the product has already acquired Radio Regulatory certifications

Specifications

	Type 1YN	Type 2AE
Part Number	LBEE5KL1YN	LBEE5PK2AE
Type Name	Type 1YN	Type 2AE
IC Manufacturer	Infineon	Infineon
Chipset	CYW43439	CYW4373E
Technology	Wi-Fi, Bluetooth	Wi-Fi, Bluetooth
Wi-Fi	Wi-Fi 4	Wi-Fi 5
Frequency	2.4GHz	2.4GHz, 5GHz
Bluetooth®	5.2 BR/EDR/LE	5.2 BR/EDR/LE
Host Interface (Wi-Fi)	SDIO	SDIO, USB
Host Interface (Bluetooth)	UART	UART, USB
Integrated Antenna	No	No
Dimension	6.95 × 5.15 × 1.1 mm	8.0 × 7.8 × 1.15 mm
Supply Voltage	3.2V to 4.2V	3.13V to 3.5V
Interface Voltage	1.8V, 3.3V	1.8V, 3.3V
FCC/IC Certified	Yes	Yes
ETSI Report	Yes	Yes
MIC (Japan) Certified	Yes	Yes
Operating Temperature (degC)	−30°C to 70°C	−40°C to 85°C
Mounting Type	SMT	SMT

Product pages
● Go here for details on Type 1YN
● Go here for details on Type 2AE

Inquiries
● Go here for inquiries on “Type 1YN” and “Type 2AE.”
● Go here to access the technical support website

Source: https://www.murata.com