Manufacturers
- Abracon
- Adam Tech
- Aerospace, Defense & Marine
- Agastat
- AIC
- AKM Semiconductor
- Alcoswitch
- Allegro
- Alps Electric
- Altera
- AMI Semiconductor
- AMP
- ams
- Analog Devices (ADI)
- Aptina Imaging
- Atmel
- Avago / Broadcom
- AVX
- Axicom
- Bccomponents
- Beyschlag
- BI Technologies
- Bourns Inc.
- Bowei Integrated Circuits
- Bridgelux
- Buchanan
- California Micro Devices
- Catalyst Semiconductor
- CGS
- Cirrus Logic
- Citizen Electronics
- CML Microcircuits
- Coiltronics
- Cooper Bussmann
- Corcom
- Core Logic
- Cree
- CSR PLC
- CTS
- Cypress Semiconductor
- Dale
- Data Image
- Deutsch
- Diodes Incorporated
- DOMINANT Opto Technologies
- E-T-A
- Eaton
- ECS
- Edison Opto
- Elcon
- EPCOS
- Epistar
- Epson
- Everlight Electronics
- Exar
- Fairchild Semiconductor
- FCI
- Freescale Semiconductor
- Fremont Micro Devices (FMD)
- Fujitsu Semiconductor
- Fulltech Electric
- General Semiconductor
- Harvatek
- Holsworthy
- Hsuan Mao Technology
- IDT
- Infineon Technologies
- Innolux
- International Rectifier (IR)
- Intersil
- IRC
- ISSI
- IXYS-IC
- Jing Cheng Electronical
- JL World
- Johanson Dielectrics
- Johanson Technology
- JRC / NJR
- JST
- KEC
- Kilovac
- Kingbright
- Kyocera Industrial Ceramics
- LEDiL
- Linear Technology / ADI
- Lite-On Technology
- Littelfuse
- Lumex
- Lumileds
- Luminary Micro
- Luminus Devices
- Macronix
- Maojwei / ZJPT
- Maxim Integrated
- MCC
- Mean Well Enterprises
- Microchip Technology
- Micron
- Microsemi
- Mini-Circuits
- Molex
- Murata Manufacturing
- Murata Power Solutions
- MWT
- National Semiconductor
- Nichicon
- Nippon Chemi-Con
- NJR / JRC
- NVE
- NXP Semiconductors
- OEG
- Omnivision
- ON Semiconductor
- Optek Technology
- Optrex
- OSRAM Opto Semiconductors
- OTAX
- Panasonic
- Peregrine(pSemi)
- Potter & Brumfield
- Power Integrations
- PowerStor
- Preci-Dip
- Prewell
- Products Unlimited
- Pulse Electronics
- PulseCore Semiconductor
- Qorvo
- Raychem
- Renesas Electronics
- RFMD
- Richtek Technology
- ROHM Semiconductor
- Rubycon
- Samsung Electro-Mechanics
- Samsung Semiconductor
- Schaffner
- Schrack
- Seiko Instruments, Inc. (SII)
- Semtech
- Sensata
- Seoul Semiconductor
- Sfernice
- Sharp Display
- Sharp Microelectronics
- Silicon Labs
- Siliconix
- Skyworks Solutions
- SoniCrest / JL World
- Spansion
- Sprague
- Stanley Electric
- STMicroelectronics
- Sunny Electronics
- Susumu (SSM)
- Taimag
- Taiyo Yuden
- TDK
- TDK-Lambda
- TE Connectivity
- Teccor
- Texas Instruments (TI)
- Thin Film
- Tianma Micro-electronics
- TOCOS
- TOKO
- Toshiba Electronic Components
- TT Electronics
- Tusonix
- TXC
- Tyntek
- Vishay
- Vishay Precision Group
- Vitramon
- Walsin Technology
- Weidmuller
- Welwyn
- Wickmann
- Winbond
- Xilinx
- Yageo
- Zetex Semiconductors
- ZJPT / Maojwei
新闻中心
New power module for mid-power electric vehicle traction inverters
2020-07-30 | 返回The global boom of vehicle electrification puts the design of cost-effective traction inverters into focus. In this context, selecting the power module plays an important role; system designers are looking for the best-sized module with the optimal silicon area for the required performance. Within Infineon’s portfolio, the HybridPACK DC6i is positioned between the HybridPACK1 family and the more powerful HybridPACK Drive family.
The new module has the same compact footprint (7.2 cm x 14 cm) as the HybridPACK1 – 25 percent smaller than the HybridPACK Drive – but the available output power is more than 50 percent higher. While the HybridPACK1 uses Infineon’s IGBT3 technology, the HybridPACK DC6i is equipped with the latest EDT2 IGBTs. Furthermore, the new module has six screw connectors to the DC-link capacitor compared to two in the HybridPACK1 family. This enables a low-inductive design with a stray inductance of 15 nH. Finally, Infineon’s patented direct-cooling wave baseplate provides an excellent and cost-effective heat dissipation with a thermal resistance from the IGBT chip junction to the fluid of 0.17 K/W.
The DC6i was designed with an efficient and automized high-volume production in mind: Press-Fit pins and additional guiding elements enable gate driver board mounting in a few seconds compared to traditional selective soldering in more than one minute.
The HybridPACK DC6i is fully qualified according to the AQG324 norm for automotive power modules.
EDT2 technology
Infineon’s EDT2 technology is an automotive micro-pattern trench field-stop cell design optimized for electric drivetrain applications. It offers a blocking voltage of 750 V, a short-term extended operation temperature of 175°C and high short-circuit ruggedness. The design tradeoff between switching and conduction losses is optimized for a real-world driving cycle with excellent light load power losses, leading to an efficiency improvement of 20 percent compared to Infineon’s previous IGBT3 generation.
Availability
The new HybridPACK DC6i is in production and will be available at distributors in September 2020. Further information is available at www.infineon.com/DC6i.
Press Photos
The new Infineon HybridPACK™ DC6i for traction inverters is equipped with EDT2 IGBT technology and offers an excellent fit for hybrid and small battery electric vehicles.
Infineon_HybridPACK_DC6i
JPG | 431 kb | 2126 x 2126 px
Source:http://www.infineon.com/