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TDK announces ultra-high AOP Analog MEMS microphone, ICS-40638

2020-08-05 | Return

> High-performance microphone offering 138dB SPL AOP
> Enabling clear audio capture in loud and noisy conditions
> Extended frequency response from 35 Hz to 20kHz

August 5, 2020

TDK Corporation introduces the InvenSense ICS-40638 MEMS analog microphone. The ICS-40638 microphone offers an ultra-high Acoustic Overload Point (AOP) of 138 dB Sound Pressure Level (SPL), exceptionally efficient 170 µA low power operation and high Signal to Noise Ratio (SNR) of 63 dB in a small 3.5 mm x 2.65 mm x 0.98 mm bottom port surface‐mount package. The analog MEMS microphone is equipped with high dynamic range, operates up to 105°C, and is designed for IoT and consumer devices.

The new ICS-40638 microphone is ideal for wearable and IoT applications, particularly in outdoor, industrial or harsh environments, where high temperature and high acoustic overload points present system design challenges. The ICS-40638 includes a MEMS microphone element, an impedance converter, and a differential output amplifier. Other high‐performance specifications include a tight ±1 dB sensitivity tolerance and enhanced immunity to both radiated and conducted RF interference. The part is ideal for noise cancelling applications in challenging environments.

“TDK has a strong presence in the wearable and IoT market segments and our full-line of MEMS microphones makes us the ideal partner to solve our customers’ audio challenges,” said Kieran Harney, Managing Director, Audio Products, InvenSense, a TDK group company. “The ICS-40638 with its ultra-high AOP and high temperature operation enables our partners to design acoustic listening systems that stand up to the loudest and noisiest environmental surroundings.”

The InvenSense ICS-40638 part and the ICS-40638 evaluation board (EVB) are now available from multiple distributors worldwide. For additional information and collateral, please visit https://invensense.tdk.com/products/analog/ics-40638/.

Glossary
> MEMS: Micro-Electrical Mechanical System
> AOP: Acoustic Overload Point
> SPL: Sound Pressure Level
> SNR: Signal to Noise Ratio
> IoT: Internet of Things
> OEM: Original Equipment Manufacturing

Main applications
> Wearables
> IoT devices
> Automotive
> Still/Video Cameras

Key features
> 5 mm x 2.65 mm x 0.98 mm package bottom port surface‐mount package
> 138 dB AOP SBL
> 63 dB SNR
> Differential analog output
> −43 dBV sensitivity (differential)
> ±1 dB sensitivity tolerance
> Extended frequency response from 35 Hz to 20 kHz
> Enhanced RF immunity
> −81 dB PSRR
> Compatible with Sn/Pb and Pb‐free solder processes
> RoHS/WEEE compliant

Key data

Product

ICS-40638

Packaging Dimensions (mm)

3.50 × 2.65 × 0.98

SNR dBA

63

Acoutsic Overload Point (dB SPL)

138

Supply Current (µA)

170

Bandwidth (kHz)

20

Low Frequency Corner Hz

35

Interface

Differential Analog


Source:http://www.tdk.com/