Posted By MaxLinear on March 14, 2019

MaxLinear, Inc., a leading provider of radiofrequency (RF), analog and mixed-signal integrated circuits for the connectedhome, wired and wireless infrastructure, and industrial and multimarketapplications will showcase its latest power management products at booth 302 atthe Applied Power Electronics Conference (APEC) in Anaheim, CA from March18-20, 2019. The company is known for providing robust, high density powersolutions offering a wide input voltage range and excellent thermalperformance.
 
Among the products demonstrated at the MaxLinear booth is the new MxL7213 dual13A or single 26A power module. This complete switch mode DC/DC power supplyincludes a wide 4.5V to 18V input voltage range and offers better efficiencyand thermal performance than the competition. The MxL7213 and the previouslyreleased MxL7204 dual 4A power module target industrial, telecommunications,networking and infrastructure equipment.
 
The MxL7213 dual step-down power module integrates the control, drivers,bootstrap diodes, inductors and MOSFETs in a single package for point-of-loadsupplies. The MxL7213 supports
two outputs each with an output voltage range of 0.6V to 5.3V, set by a singleexternal resistor. The MxL7213 requires just a few input and output capacitorswhich simplifies design and shortens time-to-market. The module supplies eithertwo 13A outputs, a single 26A or up to 100A when paralleled with additionalMxL7213 modules. Attention to thermal design, component selection and internalconstruction results in higher efficiency and extended operating range relativeto devices with the same industry standard pinout.
 
“The MxL7213 is our highest output current power module solution to date,” saidJoseph Tseng, MaxLinear Director of Marketing, Power Management. "It isthe latest addition to our growing family of current mode, dual channel LGA/BGApower solutions targeted at networking and industrial equipment such as opticalrouters and test equipment.  Our dual power modules offer system designerssignificant advantages over competing devices such as improved efficiency andbetter thermal performance.”
 
To see a live demonstration of the MxL7213 thermal performance and learn moreabout our DC/DC power management solutions, visit MaxLinear’s booth 302 at APEC2019. 
 
The MxL7213 is available now in two space-saving and thermally enhancedpackages: a 15mm x 15mm x 4.41mm LGA package and a 15mm x 15mm x 5.01mm BGApackage with RoHS compliant terminal finish. Samples and evaluation boards areavailable.  For more information, visit https://www.maxlinear.com/mxl7213.

 

source：https://www.maxlinear.com