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News
Toshiba Electronic Devices & Storage Corporation Launches Two New ICs Compliant with Bluetooth® Ver.5.0
2018-01-09 | ReturnTOKYO-Toshiba Electronic Devices & Storage Corporation today announced "TC35680FSG” with built-in Flash ROM and "TC35681FSG," additions to its line-up of ICs compliant with the Bluetooth® low energy standard [1]. Sample shipments start at the end of this month.
The new ICs support all data rates required for the high-speed features, 2M PHY and Coded PHY (500kbps and 125kbps) added to the Bluetooth® low energy Ver.5.0 standard. Receiver sensitivity at 125kbps is -105dBm, an industry-leading [2] level, and a built-in high efficiency power amplifier in the transmission block realizes up to +8 dBm transmission power. All these features contribute to long-range communication with low current consumption.
Based on an Arm® Cortex®-M0 processor, the new ICs incorporate a 256KB Mask ROM that supports Bluetooth® baseband process, and 144KB of RAM for processing Bluetooth® application programs and data.
Additionally, 18-port GPIOs, which can be set to 2 channels each for SPIs, I2C, and UART are also included as interfaces, allowing structuring of systems that connect to various peripheral devices. These GPIOs can be set for a wakeup function, 4-channel PWM, 5-channel AD converter interfaces, a control interface of an external amplifier (option) for long-range communication, and others.
"TC35680FSG" has 128KB of Flash ROM to use for storing user programs and various data in stand-alone operations, suiting it for diverse applications and removing the need for an external non-volatile memory in stand-alone operations. This also reduces the parts count, winning reductions in cost and mounting area.
"TC35681FSG" has no built-in Flash ROM and operates in combination with an external non-volatile memory or host processor. A wide operating range of -40° to +125°C makes it suitable for applications exposed to high temperatures.
The addition of the new products to its line-up ensures Toshiba Electronic Devices & Storage Corporation’s support for the integration of Bluetooth® low energy products into IoT devices, where recent years have seen growing demand for high-throughput and long-range communication. Delivering a line-up with a wide operating temperature range also allows application in industrial applications, and improves product value for users in many areas. The company plans to add a product line-up for automotive applications in the near future.
Main Features
>Low power consumption:
11.0mA (transmission operation at 3.0V, output power: +8dBm, at 1Mbps)
5.1mA (receiver operation at 3.0V, at 1Mbps)
100nA or less (at 3.0V) in Deep Sleep
>Receiver sensitivity: -94.5dBm(at 1Mbps), -105dBm (at 125kbps)
>Transmission power: +8dBm to -40dBm
>Supports Bluetooth® low energy Ver.5.0 central and peripheral devices
>Built-in GATT (Generic Attribute Profile)
>Supports servers and clients defined by GATT
>Bluetooth® low energy Ver. 5.0 additional features [3]
LE 2M PHY
LE Coded PHY (500kbps and 125kbps)
LE Advertising Extensions
LE Channel Selection Algorithm #2
>Built-in 128KB Flash ROM (only TC35680FSG)
Applications
>Applications that need long-range communication such as beacon tags, IoT devices and industry equipment
Main Specifications
Part number |
||
Supply voltage |
1.9V to 3.6V |
1.8V to 3.6V |
Current consumption in TX operation |
11.0 mA (3.0V operation; output power: +8dBm, at 1Mbps) |
|
Current consumption in RX operation |
5.1mA (3.0V operation, at 1Mbps) |
|
Current consumption in Deep Sleep |
100nA or less (3.0V) |
|
Operating temperature range |
-40 to +85℃ |
-40 to +125℃ |
Package |
QFN40 5mm×5mm, 0.4mm pitch |
|
Wireless communication |
Bluetooth® low energy Ver.5.0 including central and peripheral functions |
|
CPU |
Arm® Cortex®-M0 |
|
Transmitter output power |
+8dBm to -40dBm (+8, +7, +6, +4, 0, -6, -20, -40dBm) |
|
Receiver sensitivity |
-94.5dBm(at 1Mbps), -105dBm (at 125kbps) |
|
Profiles |
HCI, GATT (Generic Attribute Profile), including server and client functions |
|
Interface |
UART (2 channels), I2C (2 channels), SPI (2 channels), |
|
Flash ROM |
128KB |
None |
Other features |
DC-DC converter |
Notes:
[1]: Low power consumption communication technology defined in Bluetooth® Ver.5.0.
[2]: As of January 9, 2018, in the Bluetooth IC industry. Toshiba Electronic Devices & Storage Corporation survey.
[3]: For details of features added to Ver.5.0, see the Bluetooth® core specifications.
* The Bluetooth® word mark and logos are registered trademarks owned by the Bluetooth SIG, Inc.
* Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
* All other company names, product names, and service names mentioned herein may be trademarks of their respective companies.
Source:http://www.semicon.toshiba.co.jp/eng/