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News
AVX Releases WBR Series Thin Film Wire Bond Resistors with Wide Customization Capabilities
2017-05-24 | Return“Our new WBR Series wire bond resistors are available in a wide range of resistive values and with several other material and performance customization options to provide ultra-stable, high-reliability solutions capable of meeting a variety of exact application specifications across a range of markets,” said Larry Eisenberger, principal technical marketing engineer, AVX. “The chips also come with unique value markings for easy identification.”
Standard design and material options for WBR Series wire bond resistors include: 0202 chips with silicon or glass substrate material, silicon chrome (SiCr) or tantalum nitride (TaN) film, and bondable gold or aluminum terminations. Standard performance options include resistive values spanning 1Ω to 4MΩ, four TCR values: ± 25, ±50, ±100, and ±150ppm/°C, and four tolerance values: 5%, 1%, 0.5%, and 0.1%. However, all of these standard offerings may be customized to suit individual application requirements.
Operating temperatures for the series span -55°C to +125°C, rated voltage is 125VDC (max.), and parts are shipped in waffle pack. Lead-time for the series is currently eight weeks.
For more information about AVX’s WBR Series thin film wire bond resistors, please click on the button below. For all other inquiries, please visit http://www.avx.com/ .
Source:http://www.avx.com/