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Commercialized Compact Wireless Modules Support Wi-Fi™ 4/5 and Bluetooth® 5.2 - Contributing to Early Market Release and Miniaturization of IoT and Industrial Equipment -

2022-08-25 | Return
Murata Manufacturing Co., Ltd. (“Murata” below) has developed and mass-produced the compact wireless module LBEE5KL1YN (“Type 1YN” below) with a built-in Wi-Fi™/Bluetooth®/Bluetooth Low Energy combo chip CYW43439 of Infineon Technologies AG (“Infineon” below). Murata has also released the compact wireless module LBEE5PK2AE (“Type 2AE” below) with a built-in Wi-Fi/Bluetooth/Bluetooth Low Energy combo chip CYW4373E of Infineon.

Following the recent years of rapid growth in the IoT market, installation of wireless communication functions on IoT devices and industrial equipment has become necessary. Compact and high-performance communication modules are required for IoT devices and compact, high-performance, and wide temperature range communication modules are required for industrial equipment.

This product achieves a compact, high-performance, and shielded structure through Murata’s unique wireless design technologies, space saving implementation technologies, and product processing technologies. While being compact, the Type 1YN achieves high speed communications while supporting Wi-Fi 4*1 and Bluetooth 5.2. The Type 2AE has high temperature capabilities while supporting Wi-Fi 5*2 and Bluetooth 5.2. With the hardware mechanism and algorithm, simultaneous use of both Wi-Fi and Bluetooth is available, optimizing both their performances. Furthermore, as control interfaces, they support PCM for audio data communications. Both are optimal for the IoT market, which requires compact, high-performance, and low noise products, as well as for applications in handheld wireless systems, gateways, and industrial equipment.
Furthermore, the modules comply to the Japanese and U.S. Radio Laws, contributing to the early stages of our customers’ product development.

*1 Wi-Fi 4: Wireless LAN standard name, IEEE802.11b/g/n
*2 Wi-Fi 5: Wireless LAN standard name, IEEE802.11a/b/g/n/ac

Key features

● Compact and high-performance SMD type

     ○ Type 1YN: Compact at a measurement of 6.95 × 5.15 mm, supports Bluetooth 5.2, Wi-Fi 4 and SoftAP
     ○ Type 2AE: Compact at a measurement of 8.0 × 7.8 mm, supports Bluetooth 5.2, Wi-Fi 5, USB2.0 and available for use in a wide temperature range of −40°C to 85°C

● Radio Regulatory certified
     ○ Individual acquisition of Radio Regulatory certifications unnecessary since the product has already acquired Radio Regulatory certifications

Specifications

 

Type 1YN

Type 2AE

Part Number

LBEE5KL1YN

LBEE5PK2AE

Type Name

Type 1YN

Type 2AE

IC Manufacturer

Infineon

Infineon

Chipset

CYW43439

CYW4373E

Technology

Wi-Fi, Bluetooth

Wi-Fi, Bluetooth

Wi-Fi

Wi-Fi 4

Wi-Fi 5

Frequency

2.4GHz

2.4GHz, 5GHz

Bluetooth®

5.2 BR/EDR/LE

5.2 BR/EDR/LE

Host Interface (Wi-Fi)

SDIO

SDIO, USB

Host Interface (Bluetooth)

UART

UART, USB

Integrated Antenna

No

No

Dimension

6.95 × 5.15 × 1.1 mm

8.0 × 7.8 × 1.15 mm

Supply Voltage

3.2V to 4.2V

3.13V to 3.5V

Interface Voltage

1.8V, 3.3V

1.8V, 3.3V

FCC/IC Certified

Yes

Yes

ETSI Report

Yes

Yes

MIC (Japan) Certified

Yes

Yes

Operating Temperature (degC)

−30°C to 70°C

−40°C to 85°C

Mounting Type

SMT

SMT


Product pages
● Go here for details on Type 1YN
● Go here for details on Type 2AE

Inquiries
● Go here for inquiries on “Type 1YN” and “Type 2AE.”
● Go here to access the technical support website

Source: https://www.murata.com